This precision-engineered fused silica wafer is manufactured from Corning 7980 Grade 0F material, delivering outstanding optical clarity, stability, and dimensional control. With a diameter of 100.00 mm ± 0.20 mm and thickness of 2.00 mm ± 0.10 mm, it is ideal for applications requiring thicker, robust optics. The wafer features a clear aperture of approximately 85%, with a high-quality surface finish of 40/20 scratch-dig and surface roughness under 1 nm for exceptional optical performance. Tight form tolerances include TTV < 5 µm, parallelism < 30 arcsec, and minimal transmitted/reflective wavefront distortion. Safety edge bevels ensure easier handling with reduced risk of chipping.