This large-format fused silica wafer is precision-manufactured from Corning 7980 Grade 0F material, providing premium optical quality, outstanding flatness, and a generous clear aperture. With a diameter of 300 mm and thickness of 1 mm, it delivers a large usable optical surface while maintaining tight tolerances for wavefront distortion and surface quality.

Optical specs include a clear aperture of approximately 85%, transmitted wavefront error < 0.25 waves/inch, reflective wavefront error < 1 wave/inch, and parallelism under 30 seconds of arc. Surface finish is 40/20 scratch-dig, edges are fine-edge ground with safety bevels, and chips outside the clear aperture are limited to < 0.5 mm. Surface roughness is under 1 nm; total thickness variation (TTV) is kept below 5 µm. These characteristics make W1153 ideal for high-precision applications in optics and imaging where large, thin fused silica elements are required.