This Corning 7980 Grade 0F fused silica wafer is precision-manufactured to offer superior optical clarity and mechanical stability. With a diameter of 100.00 mm ± 0.10 mm and a thickness of 1.00 mm ± 0.05 mm, it supports demanding applications that require consistent performance and tight dimensional control. The surface finish is held to a 40/20 scratch-dig standard, while edge treatment features a C-bevel and fine ground finish for improved handling and reduced edge defects. Warp is limited to 15 µm, bow to 10 µm, and the surface roughness is ≤ 13 Å RMS for minimal scattering and high-quality optical transmission. Clear aperture covers approximately 85 % of the central region.