This Grade 0F Corning 7980 fused silica wafer offers excellent optical quality and precision for demanding applications. It is laser-cut to 100.00 mm ± 0.10 mm diameter and polished to a thickness of 0.50 mm ± 0.05 mm. With a clear aperture of roughly 85% in the central region, it delivers high usable area while maintaining strict form tolerances. The surface finish meets a 40/20 scratch-dig standard. Other key flatness and form specs include TTV (total thickness variation) ≤ 2 µm, bow ≤ 20 µm, and warp ≤ 25 µm. C-beveled edges improve handling and reduce edge damage risk.