This optically high-grade fused silica wafer is made from Corning 7980, Grade 0G, offering excellent clarity, dimensional precision, and mechanical stability. The wafer measures 200.00 mm ± 0.10 mm in diameter and 1.00 mm ± 0.05 mm in thickness. It has a clear aperture of at least 170 mm, giving a large usable area while maintaining tight tolerances. The surface finish meets 40/20 scratch-dig standards with < 1 nm RMS surface roughness. Key form and optical quality parameters include a reflective wavefront error of ≤ 2 waves/inch, parallelism better than 10 arc-seconds, C-beveled edges, and chip size limited to < 0.25 mm outside the clear aperture. With fine edge grinding throughout, this wafer combines performance and manufacturability.