This precision fused silica wafer is manufactured from Corning 7980 Grade 0F material, bringing together excellent optical clarity, thin-form durability, and tight tolerances. Its 200 mm diameter provides a large usable area, while the 0.50 mm thickness keeps the wafer light and thin for applications where minimized optical path length is critical. With about 85% clear aperture, this wafer delivers a high fraction of usable surface area.