The W1167 Silicon Wafer (25.4mm dia. x 1mm thick) is a precision-engineered substrate designed for applications that demand consistent material quality and reliable performance. With a standard 1-inch diameter and 1mm thickness, this silicon wafer provides a stable and uniform platform ideal for use in optical systems, metrology, and semiconductor-related processes. Its material properties make it well-suited for applications requiring durability, thermal stability, and compatibility with advanced fabrication techniques.

Manufactured with Sydor’s high-precision polishing and fabrication expertise, the W1167 wafer delivers excellent surface quality and dimensional accuracy for demanding technical environments. Commonly used in applications such as photolithography, MEMS development, and wafer-level packaging, it supports a wide range of research, testing, and production needs. Whether used as a carrier wafer, substrate, or optical component, this silicon wafer offers dependable performance and versatility for engineers and researchers alike.