This precision fused silica wafer is crafted from Corning 7980 Grade 0F material. It has a diameter of 200.00 mm ± 0.20 mm and a thickness of 2.00 mm ± 0.10 mm, offering substantial size and strength while maintaining superior optical performance. With a clear aperture of approximately 85%, most of the diameter is usable, making it ideal for large-area optical components.

The optical quality is notable: transmitted wavefront error is under 0.25 waves per inch (at 632 nm), reflective wavefront error is under 1 wave per inch, and parallelism is held to less than 30 arc-seconds. Surface cosmetics meet a 40/20 scratch-dig standard; edge treatment includes a safety bevel, fine edge grinding, and chip sizes limited to < 0.5 mm. Surface roughness is better than 1 nm RMS, ensuring high clarity and minimal scattering.