This high-precision fused silica wafer is made from Corning 7980 Grade 0F material and engineered for demanding optical performance and mechanical stability. With a diameter of 100.00 mm ± 0.20 mm and a thickness of 3.00 mm ± 0.10 mm, it offers a robust build while maintaining excellent optical clarity. The wafer comes with an approx. 85% clear aperture, and surface quality held to 40/20 scratch-dig standards. Wavefront distortion is tightly controlled: transmitted wavefront < 0.25 waves/inch, reflective wavefront < 1 wave/inch. Parallelism is < 30 seconds of arc. Additional features include safety bevels, chips < 0.5 mm, fine edge grinding, surface roughness < 1 nm, and a TTV (total thickness variation) of < 5 µm.