This precision-cut square plate of Corning 7980 fused silica (10 mm × 10 mm in size, 0.800 mm thick) offers a compact, ultra-thin optical substrate ideal for micro-optical, sensor window, MEMS, photonic or wafer-level packaging applications. Supplied by Sydor Optics in Rochester, NY, it is designed for integration into demanding systems where size, thickness and optical material quality all matter.